記事
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24 January 2025
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Modern Design solutions in high power IGBT modules
24 January 2025
The article discusses modern approaches to the design of power semiconductor modules. Using the example of devices with a 140 mm baseplate and the MIXM and MIXV modules developed by JSC Proton-Electrotex, it demonstrates how the design of these modules has evolved toward reducing the inductance of power circuits and optimizing the layout of external connections. The article also examines possible future directions in the development of IGBT module design, including major modernization of heat dissipation structures and the use of semiconductor chips with the capability to monitor temperature and instantaneous current values in real time.
